Well, on my part deliberately discarding the original pins was a bad idea to start with. They´re shaped like tweezers on one end for a reason and that reason is to sustain the entire module. One should always clamp the "tweezers" to ensure a good grip and only then should they be soldered to the pads. Relying solely on solder connections that are glued to a ceramic substrate to have the double function of mechanical support while carrying electric signals at the same time is a no-no IMO especially when the modules can get quite warm. I took the idea from a tech whose work I respect but this is not a good solution.
Now imagine an 80017A built as it should have from the start: on a double sided FR4 PCB with real copper traces and real SMD resistors. Something that´d resemble the AR clones in appearance, made with real BA662s and IR3109 instead of the LM13700s. With all the thousands of "acetoned" chips out there, wouldn´t that be fantastic?
I have found my notes on the correct pin numbers for the SOIC Ba662 and the resistor values. I´ll share them tomorrow if it´s of interest.
Cheers!
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